Point2 Technology announced on March 4 that it has raised US$23 million in Series B1 funding from Bosch Ventures and Molex.

The company’s e-tube technology is 80% lighter and 50% less voluminous than traditional copper wire. Additionally, it can reduce power consumption and cost by 50% compared to optical cables, breaking conventional wisdom about delays between AI servers and switches. This innovative e-tube technology is emerging as a market leader in next-generation multi-terabit interconnect technology.

This investment will accelerate Point2 Technology’s development of ultra-high-speed interconnect products for AI and automotive applications. The funding round saw participation from major companies and repeated investments from Nautilus, Timefolio, Quantum Ventures, K2, and GU, with new investors including KAIC TO Ventures, POSCO Technology Investment, TKG Ventures, and D3, indicating a positive evaluation of interconnect solutions for the AI era.

With the funds raised, Point2 Technology aims to enhance its competitiveness by ramping up production of 800 Gbps interconnect chipsets for AI servers, developing next-generation 1.6 Tbps interconnect products for AI servers, and mass-producing optical dispersion chips for 5G/6G networks, as well as accelerating its entry into the automotive network interconnect market.

Park Jin-ho, CEO of Point2 Technology, stated, “Our initial goal is to become the world’s leading interconnect technology company with overwhelming competitiveness in AI/ML data centers and next-generation automotive applications.”

To date, the cumulative investment into Point2 Technology has reached US$54 million.