The SDV technology car demonstrates the best and most innovative solutions the Continental Automotive group sector portfolio has to offer in one vehicle architecture. The different technologies used include automated parking functions with holistic motion control, ultrasonic sensors, an integrated brake system, and surround view cameras – all within an innovative cross domain HPC.
“The goal is not only to show how well functions work, but to validate how well multiple technologies can be integrated and work alongside each other in HPC-based vehicle architectures within a software-defined vehicle,” explained David Muscat, Segment Chief Engineer, Architecture and Networking Business Area, Continental North America. “This is a crucial step to convince the market that the goal to combine several control units in one HPC is not just feasible but can also render the cost benefits we want to achieve.”
One key element for the implementation of the very first cross-domain HPC in a real car is the Snapdragon Ride Flex SoC, the automotive industry’s first family of SoCs that supports multi-modal critical workloads on a single chip. The Flex SoC is designed for optimized cost, power and performance. It makes it possible for automakers and suppliers to accelerate their time-to-market advantage and embrace a seamless, open, and adaptable approach to designing their vehicles. Passengers benefit from an enhanced driving experience characterized by added assistance, safety, and comfort.
“The concept of the software-defined vehicle relies heavily on high-performance hardware that can handle the amount of data,” said Muscat. “Qualcomm Technologies is a strong technical collaborator of Continental who shares our ambitious approach to bring the software-defined vehicle onto the road.”
“The evolution of in-vehicle automotive infrastructures has reached a critical point as both data and the compute power needed to process it are rapidly expanding. The Flex SoC addresses this shift as the ideal compute solution for software-defined vehicles, offering an integrated, open and scalable architecture for next generation vehicles that is cost-effective and scalable across all vehicle tiers,” said Anshuman Saxena, VP, Product Management, ADAS, Qualcomm Technologies, Inc. “We’re excited to continue the momentum of the Flex SoC through our work with Continental.”